I enjoyed your article, however as both an engineer and an investor, I would love to see you take this to the next level and discuss how this affects NVDA vs AMD vs AVGO and MU vs SK Hynix vs Samsung.
There is a problem with this assumption, which is that you can create a SRAM only die for stacking at 2nm. AMD did their SRAM at 7nm. There is a reason for why they chose 7nm.
I enjoyed your article, however as both an engineer and an investor, I would love to see you take this to the next level and discuss how this affects NVDA vs AMD vs AVGO and MU vs SK Hynix vs Samsung.
Great article also Ben. You are keeping me busy.
This was an old one lol
Will HBM move to hybrid bonding towards end of 2030?
There is a problem with this assumption, which is that you can create a SRAM only die for stacking at 2nm. AMD did their SRAM at 7nm. There is a reason for why they chose 7nm.
What is the reason from your point?